These automatic high-efficient machines are available iv various structural designs: a conventional or twin execution, a tandem type, adapted to diverse formats of a wafer slab, in a set with feeding, pushing & distribution devices providing for a continuous feeding of cut products to the glazing and /or packing complex.

Special machines are also offered suitable for cutting wafer slab into triangular –shaped products.

In the production of hollow wafers cutting machines can be substituted for stamping or blanking machines.

By means of special cutters round wafer products can be produced from a rectangular wafer slab.